Raising over 20 billion in half a year! What are the highlights of Huawei and Tianshu Zhixin's leading domestic new AI chip products and solutions?

According to incomplete statistics from the financial media, in the first half of 2021, domestic and foreign AI companies including Horizon, Suiyuan Technology, Moore Thread, and Baidu reached 27 financings, with a total financing amount of more than 20 billion.

Major AI investments, such as Horizon's C2 and C3 rounds of financing in January and February 2021, respectively, and the financing amount reached 400 million US dollars and 300 million US dollars respectively; on March 1, Baidu Kunlun chip business completed independent financing, after the investment The valuation is about 13 billion yuan, the lead investor is CPE, and the investors IDG, Legend Capital, and Yuanhe Puhua; in April, focus on cloud reasoning. Hanbo Semiconductor completed the A+ round of financing on April 1. Reached 500 million yuan; on July 7, Ruisi Zhixin carried out a Pre-A round of financing with an amount of nearly 100 million yuan, which was jointly led by Hikvision and Yaotu Capital, iFLYTEK Ventures and Sunny Central Research China Academy of Sciences, Allwinner Technology, Chasing Venture Capital, Tongchuangweiye followed suit, and old shareholders Lenovo Ventures and Zhongke Chuangxing continued to raise their bets. This round of financing will be used for chip iteration, related algorithm development, team expansion, etc.

At the 2021 Fourth Artificial Intelligence Conference hosted by electronic enthusiasts, Imagination senior marketing manager Huang Yin told reporters that in 2024, the market size of edge-side inferred chips and cloud-side inferred chips will reach 11 billion U.S. dollars, of which edge-side inferred chips will occupy 63.6% share.

In addition, according to CCID Consultings forecast, Chinas AI chip market will grow to 30.57 billion yuan in 2021, a year-on-year increase of 57.8%. In addition to traditional AI chip suppliers such as Nvidia, Intel, and AMD, Huawei, Tianshu Zhizhi, and Horizon have all released AI chips or solutions. Let everyone take a look at the most powerful AI chip and solution display.

Huawei Shengteng AI solution unveiled at WAIC Conference

Recently, Huaweis rotating chairman Hu Houkun stated at the World Artificial Intelligence Conference that Huawei relies on Ascends basic software and hardware platforms, including Ascend processors, Atlas series hardware, heterogeneous computing architecture CANN, AI framework MindSpore, and AI application enablement ModelArts, etc., Huawei has initially constructed a complete artificial intelligence industry ecology.

Shi Pei, director of the Ecological Development Department of Huawei's China Government and Enterprise Shengteng Ecological Development Department, told the media that at the WAIC conference, Huawei has launched a major release of Shengteng Smart Manufacturing, Shengteng Smart City, Shengteng Zhixing, and Shengteng Smart Patrol solutions. The smart series of solutions are oriented to manufacturing, smart city, transportation, energy, and power industries, and are of great significance for realizing the deep integration of AI technology and industry scenarios, opening up the "last mile" of the AI ​​landing industry, and allowing AI to enter the core production links of the industry.

Huawei officially revealed that the Pangu series of ultra-large-scale pre-training models released by HUAWEI CLOUD this time includes one of the worlds largest visual (CV) pre-training models with 3 billion parameters, as well as the 100 billion jointly developed with Loop Intelligence and Pengcheng Lab. The worlds largest Chinese language (NLP) pre-training model with parameters and 40TB training data. In the future, Huawei Cloud will release pre-training models in multiple fields such as multi-modality and scientific computing.

Tianshu Zhixin's first 7-nanometer GPGPU cloud training chip BI and product card officially unveiled

At the WAIC conference, Tianshu Zhixin demonstrated the first domestic 7-nanometer process cloud training chip B1 and GPGPU (General Purpose Computing GPU) product card that is fully self-developed and under the GPU architecture. This chip uses a 7-nanometer process, accommodates 24 billion transistors, and uses 2.5D CoWoS wafer packaging technology. It supports FP32, FP16, BF16, INT8, and other multi-precision data mixed training, supports inter-chip interconnection, and single-core computing power per second is [email protected] FP16.

BI chips provide nearly twice the performance of mainstream manufacturers' products with 1/2 the chip area of ​​similar products and lower power consumption. It focuses on high performance, versatility, and flexibility, provides artificial intelligence and related vertical application industries with computing power that matches the rapid development of the industry, and solves the pain points of application industries such as difficult product use and high development platform migration costs through standardized software and hardware ecology.

In addition, Denglin Technology displayed its own innovative GPGPU chip, dedicated to solving versatility and high-efficiency problems. On the basis of providing CUDA/OpenCL hardware acceleration capabilities, it fully supports various popular artificial intelligence network frameworks and underlying operators.

Horizon Journey 5 passed the SGS-TUV ISO 26262 ASIL-B functional safety product certification

On July 5, Horizon officially announced that the Journey 5 chip successfully passed the SGS-TÜV ISO 26262 ASIL-B Ready functional safety product certification. SGS TÜV Saar (Global Functional Safety Technology Center), a world-renowned inspection, appraisal, testing, and certification organization, issued a certificate to Horizon.

In the field of domestic AI high computing power chips, Horizon's Journey 5 performed well. It is reported that Horizon will soon launch the industry's first full-scene whole-vehicle intelligent central computing chip that integrates autonomous driving and intelligent interaction, the Zhengcheng 5 series, with a single chip AI computing power up to 128TOPS. Horizon said that based on the journey 5 series of chips, Horizon will launch a series of intelligent driving central computers with AI computing power up to 200-1000 TOPS, which will have the industry's highest FPS (frame per second) performance and lowest power consumption.

Journey 5 is China's first automotive-grade AI chip developed based on the ISO 26262 functional safety process. In September 2020, Horizon passed the ISO 26262:2018 functional safety process certification. After 9 months, the functional safety architecture and specific design of Horizon Journey 5 chip products successfully passed the ISO 26262 ASIL-B Ready product certification. Under the escort of the functional safety management certification system, Horizon Travel 5 series chips are designed and developed in strict accordance with the ISO 26262 functional safety development process. The single-chip meets the ASIL-B level requirements, and the system application meets the highest safety level ASIL-D requirements of the automotive industry, which will help The intelligent driving industry enters the fast lane more safely.